Quote:
Originally Posted by Ambermile
So then, what about the switching noise from "several transistors" next to each pixel? Not to mention the heat generated by having those on the chip as well? Add to that the significant increase in physical chip size and consequent increase in TEC size and current requirements? Pixel binning should also be an option, not a requirement surely?
arthur
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Yep, I see your point. This is the reason why Canon design and manufacture their own CMOS sensors. They use "amplifiers" that replace the transistors - advanced signal converters to make the pixels more sensitive. In addition to this they also have a noise frame subtraction circuit which is performed prior to final image output.
These two components significantly reduce noise. From a TEC and current requirements, CCD's are actually require more power and cooling than their CMOS cousins to perform well. I read somewhere that CMOS sensor uses 1/5th the power of a CCD chip.
Indeed pixel binning should be optional. Actually, I'm not aware of any CMOS sensors that allows you to bin. It maybe possible through modified camera firmware. If the camera could bin, sensitivity would increase and shorter exposures would result, thus reducing noise. I never said any of this was a requirement.
Quoted from the MaximDL manual;
"
Important Note: Some cameras use a TC-237 guide sensor instead of the original TC-211 guide sensor. These sensors have much smaller pixels; it is strongly recommended to operate these sensors at 2x2 or 3x3 binning."
Based on these circumstances and your arcsec/pixel configuration would I deem binning a requirement for guiding purposes. Actually, having the STL11k with the TC-237 chip, I bin when guiding. I'm sure others do too.