Quote:
Originally Posted by Hans Tucker
During my time in the RAAF and my posting to 481SQN Workshop, at a time when the Military was self sufficient .. to a degree and maintenance was not overly contracted out, I was lucky enough to get on a Micro-Miniature Component Repair (MMCR) Course. It involved 2 weeks practical training in the repair of Multi-Layered Circuit Boards under a Microscope. Excavating down layers to repair a broken track. The most technically challenging course I had ever completed. It gave me an appreciation of the challenges of electronic repair. Eventually that method of repair was discarded as being too labour intensive for the gains. So they simply got a new board and repopulated.
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I've done courses like that.
A lot of chips now are BGA type. Ball Grid Array.
They are difficult to replace and you really need a heat chamber
where you can ramp up the temperature
in a controlled fashion for manufacturing but
for repair you take your chances.
You need an X-Ray machine to check it all afterwards but
even then the warranty returns can be too high to make it viable.
A lot of stuff was not made to be repaired.
see here:
https://www.youtube.com/watch?v=zdvvk0NdAy0
