Quote:
Originally Posted by luka
How will we actually mount our Peltier? One side to sensor and the other to enclosure (with copper inbetween to fill the space)?
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Gary has this covered, a slug of copper between the rear HSF and TEC. The rear HSF mounted on rear case and sealed to it. Of course the distances to Sensor etc have to be reasonably precise.
Quote:
Originally Posted by luka
When you say the box will not seal, are you talking about the seal between the lid and the base? We could run a thin layer of silastic on the outside after everything is screwed down.
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Just a little dubious of sealing capabilities of the box. Its not exactly machined quality! I've seen air leaks thru pins of connectors ...tiny very slow bubbles but more than enough wreak havoc. A perfect seal is probably not achievable with the case IMHO. We can probably get it well sealed but intrinsically its not something ever designed for sealing like this. This doesn't mean it won't work...obviously it does, proof seen in other builds.
Quote:
Originally Posted by luka
We could run a thin layer of silastic on the outside after everything is screwed down. Or even squeeze some into the gap where the rubber seal is. It will look nicer but it will be more difficult to take the camera apart.
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Yes some silastics seal ok when run in thin beads, especially between mating surfaces screwed down. The case comes with a seal, neoprene or such like.
Quote:
Originally Posted by luka
Regarding the moisture control, what if we keep everything (sensor + electronics) in one chamber, fill it with Argon and silica gel packs. The moisture levels will be quite low. Then we could add a humidity sensor inside the box with one wire going outside to a small display which shows the humidity inside the box. This will show when refills are needed..
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Yes this is the plan, seal it all, as discussed we might run into issues as we need a purge port (which we looked at with silica gel), which is probably right on the limit of fitting the case.
Quote:
Originally Posted by luka
Or we could copy Filip's approach, get a piece 3D printed (or milled) that screws into the existing PCB posts and has a large rubber o-ring which will seal the sensor enclosure. We could also glue the extension sensor posts, just like Filip did.
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I think the original designers looked at this and decided its much cheaper and easier to try a "sealed case". Which is what we need, a cheap easy approach. Thus sticking with a case approach, with a purge port and sealed connector is out best bet. Seal the rear HSF and front nose piece to the case with a thin silastic bead. The connector is sealed, the purge port can be the silica gel ports we looked at.
We assemble the unit, leave open the purge port, soak it in Argon in a plastic bag, open bag seal the port...done. When you open the plastic bag keep its opening upright (Argon being denser than air) we can keep the item reasonably filled with Argon as we screw in the port. Of course we can leave the port in the bag and probably start screwing it in wile still sealed.