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Daniel: Bird and Lee are correct.
There's an old saying 'heat the job not the solder'.
Using excess heat will cause solder blobs just as will not properly heating the surfaces to be joined and adds the risk, when soldering circuit boards, of detaching the tracks from the base. Only use enough heat to melt the solder neatly without producing clouds of smoke off the tip of the iron. Always clean the tip of the iron and then 'tin' it prior to use. 'Tinning' is merely touching the solder on the tip and allowing the solder to form a thin film over it. You can shake off any excess, or wipe it on a wet sponge (there are solder sponges readily available at electronic shops - these are heat resistant and don't burn if too much heat is applied, unlike a common variety kitchen sponge. They normally have small slits in them in order to catch the solder). I usually wipe the tip after the completion of each joint.
While it depends on the job you are doing, if you can run the iron around the joint as you apply the solder then so much the better. As a general rule it is not necessary to swamp the job with the solder. Least is best, provided that the final joint is clean and properly done.
You will find that rosin cored solder is the norm in electronic shops. Reels do though come in different diameters. I usually keep three different width reels on hand. You will have to experiment to find out which suit your purpose. For most people a reel of solder will last a long time, so the investment is well worth it.
*edit*
Forgot: As well as tinning the tip of the iron; if you can, also tin the components.
I hope that all makes sense.
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