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If (big if) I understand the paper correctly...
If the removal rate of 1500/2000 grit is greater than the deposition rate of the chemical layer, you would be better off smoothing to the finest grit possible, until the pads are the next step.
Then the pads to polished out, then the laps and parabolisation work.
You would still create the chem layer in lap polishing, but the P/V catchment area would be smaller prior to commencement.
Chem layers should not be present till after the polishing pad stage. You would be down around 1-2nm on 3-5nm polishing pads and working closer to the substrate after smoothing and flash polish on the pads.
But how to test...
*be interesting to see if coating failures lined up to surface composition, silca/defused and concentrates levels.
Last edited by mura_gadi; 05-05-2022 at 06:02 AM.
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