Quote:
Originally Posted by traveller
That's how I understood the workings of TEC units Peter.
Just revisiting post from Rowland below, there seems to be a case for the TEC to be attached directly to a larger conductive surface rather than to have a smaller fan pushing the cooled air around, provided that conductive surface is conforms to the body contours of the camera to get even cooling.
Therefore, I wonder if we may get a better cooler box by building a copper or aluminium "armour" (rather than a box) around the camera body and attach the TEC unit directly to the large surface area of the armour. This would provide more efficient cooling   than a fan pushing the cold air around inside a box. The armour can then be encased in a box filled with foam like the link provided by John K below with an external fan extracting the hot air from the reverse side of the TEC unit.
What do you think?
Bo |
I'll throw in my 2 cents worth. I agree that conductance via metal foil wrapping is likely the most efficient means for heat/cold transfer to where you need it without worrying about cooling the air and then moving it within a chamber. It may also reduce the risk of icing at the peltier because of the large surface area created by the foil.
Surrounding the foil in foam insulation would allow you to make the package smaller or indeed use more insulation for the same size package.
Attaching the cold side of the sensor to the foil armour effectively would be really important.
Ted