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Getting close. More generous spacing and gaps. Some small adjustments required, on second look, but this is the RC board, as far as I'm concerned. It fits clear of the battery door on the camera base with the MOSFET in contact with the main cooling heatsink.
A smaller version demonstrated the same perceptibly noise free performance, as the original huge ground planes - confident that this will do the same.
It was easier and less time consuming to draw it up on the board editor (Eagle CAD). Consequently, there is no schematic. It's not complex and should be easy to follow.
As mentioned earlier it is all based around more thorough and careful separation of ground sources from analog and digital devices and sensors, leading back to a common ground at the microprocessor board.
The planes, in simple terms, produce low inductance and low impedance pathways to a common ground, with a high impedance connection between analog and ground planes to balance potential difference - that's the theory, anyway. Not new by any means, but a departure from the use of snubber networks for mosfets.
On to an electronics compartment-to-heatsink sub-frame, to stablise the otherwise flexible copper cold finger. I want this to be as neat and compact as possible with basic/convential tools. Anyone should be able to build this - that's the goal. "Some say he's a dreamer, but..."
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