It seems FTD2232 is weak... Hope all other chips are OK.
Remove LQFP is easy if you have a heat gun
By the way, how do you remove the CCD from D70 board? with heat gun or electric iron&desoldering pump？ From ICX413 datasheet the soldering temperature should not exceeds 80 degree, we use electric iron&desoldering to remove it from D70 board, and then someone uses heat gun to isolate the CCD from the aluminum board （heat the back of aluminum with about 350 degree and then the glue melts）