Quote:
Originally Posted by Shiraz
only going by what they say in the article I linked to:
This meant that it would
not be possible to form the on-chip lenses and
color filters over 1 μm pixels. To resolve this
issue, Sony developed a new wafer thinning
technology to assure that such distortion and
warping does not occur.
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Having had a bit of a read elsewhere, I suspect something was lost in translation at Sony....while thinning and back illumination have been synonymous they are not the same thing.
Emor R sensors have their photodiodes below the lenslet array but above the wiring architecture..... very clever by the way....but as far as I can tell they are not "thinned" in the conventional sense....what Sony have done is reverse the stack....but called a "thinned" sensor as above.
The CMOS stack reversal is consistent with their press release here:
“Sony has succeeded in establishing a structure that layers the pixel section containing formations of back-illuminated structure pixels over the chip affixed with mounted circuits for signal processing, which is in place of supporting substrates used for conventional back-illuminated CMOS image sensors,” (I note there is no mention of ablation of the silicon substrate)
Could also be a case of they aren't telling anyone exactly what they do due commercial sensitivities
