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Hi folks. I've been watching the CN thread closely and believe the system is still in a little bit of flux.
For example I was waiting for the round PCB ver but this appears not ready. Also, this impacts on thermoelectric cooler design, which is being implemented by some users but not yet ready.
Of course I could do my own cooling but if it's already in development I'd rather wait.
I will be making this camera, but believe it's not ready yet. Time frame....My best guess is later this year.
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