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Old 21-07-2016, 06:03 AM
flolic (Filip)
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flolic is offline
 
Join Date: Jul 2016
Location: Split, Croatia
Posts: 48
Hi all, Filip from "the other" forum here
I just want to clear few things regarding design of my camera housing. First, sensor will be sealed in it's own chamber. This is not the easiest thing to do, but it is certainly the best thing to do if we think about moisture control and possible condensation problems. Air volume in that chamber is quite small (comparing to other design possibility to seal complete electronics). Plus I will fill the chamber with dry Argon gas and include some small piece of desiccant sheet.
Connection between CCD and PCB is via few stacked sockets, with one of them glued to aluminium bracket that will provide mechanical support and sealing (with additional O-ring).

Ok, let me just include few images for you to see what I am talking about

CCD socket (with sealing)
https://dl.dropboxusercontent.com/u/...ccd_socket.jpg

https://dl.dropboxusercontent.com/u/...cd_socket1.jpg

This is how CCD will be connected, with individual pins to reduce thermal transfer. Plastic cup over the sensor will keep it pressed onto the TEC module and centered in the chamber.
(please ignore the greasy fingerprints )
https://dl.dropboxusercontent.com/u/...cd_socket2.jpg
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