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I had my first response from SBIG on this which reads as
"HI Raki,
This artifact is associated with the silicon substrate matrix in the CCD, the physical construction of the sensor. Low signal levels, binning, and low temperature exaggerate this effect.
Techniques you may use to minimize this effect.
Capture images 1X1 or 2X2, dither the mount between images, and set the cooling no lower than -20C.
What is the camera serial number?"
To be honest I quite didn't get all the technical details so I have replied him with additional questions. Since my last post I have tried few additinal things suggested by few members and none of the following made a diffrence:
1. change usb cable
2. detach remote guide head
3. I have tried CCDOps as suggested in this email. the process seems to detect the banding but end result looks quite the same!
I will try setting the temp to -20 next to see if that makes any diffrence or not.
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